|
 |
| |
 |
We
make:
 |
Single
side up
to 14
layers
Rigid
PCBs |
|
Flash
/ Hard
Gold Plating
(120u”) |
|
Lead
Free Difference
finishing
/ Hot
Air Solder
Leveling
|
|
Peelable
Mask /
Carbon
Ink Printing |
|
Immersion
Tin /
Gold (Flash/Thick)
/ Siliver
|
|
Selective
Plating
/ Entek
Coating |
|
|
CNC
V-Cut
/ Gold
Finger
Process |
|
Blind/Buried
Via Hole
for M/L |
|
RoHS
or Hologen
Free PCBs |
|
Flexible
or Flexible
–
Rigid
single
&
multilayer
PCBs |
|
Aluminum
Based
Single
&
Double
Side PCBs |
|
| Delivery
Lead Time |
|
|
|
Single
Side
PCBs
–
1 week |
| Double
Side PCBs
–
10 days
|
| 4-6
layers
PCBs –
14 days
|
| 8-10
layers
PCBs –
21 days
|
| 12-14
layers
PCBs –
30days
|
|
|
|
Normal
|
4
days
for
Single
Side
PCBs |
| 6
days for
Double
Side PCBs |
| 10
days for
4 layers
PCBs |
| 12
days for
6 layers
PCBs |
| 14
days for
8-10 layers
PCBs |
| 21
days for
12-14
layers
PCBs |
|
Quick
turn
|
| 2-4
days for
Single
&
Double
Side PCBs |
| 7
days for
4-6 layers
PCBs |
| To
be confirmed
after
checked
your PCBs
specification
for 8-14
layers. |
|
| Single
Side PCBs Series |
|
 |
|
 |
 |
|
DSC01034
Specification:
FR-4
1.6mm,
1g
copper,
single
side.
Flash
gold
plating,
LPISM,
outline
by
punching
Application:
Keyboard
Other
Material
could
be
used:
CEM-1,
CEM-3,
FR-1
&
FR-2
|
|
 |
 |
|
|
| Double
Side PCBs Series |
|
|
|
|
|
|
DSC00266
Specification:
FR-4,
1.6mm
,
1g
copper,
double
side
HAL
with
hard
gold
finger
plating,
LPISM
outline
by
CNC
Routing
&
gold
finger
chamfering
Application:
Add
on
card
for
computer
|
|
|
|
|
|
|
|
DSC00265
Specification:
FR-4,
1.6mm,
1g
copper,
double
side
Immersion
gold
plating,
LPISM,
outline
by
CNC
Routing
Application:
Databank
|
|
|
|
|
|
| Multilayers
PCB Series (4-14
layers) |
|
|
|
|
|
|
DSC00267
Specification:
FR-4,
1.6mm
,
20g
copper,
4
layers
Entete
finishing,
LPISM,
outline
by
CNC
Rounting
&
v-cutting
Application:
Telecom
|
|
|
|
|
|
|
|
DSC01037
Specification:
FR-4,
1.6mm
,
10g
copper,
8
layers
Immersion
tin,
LPISM,
outline
by
CNC
Rounting
&
v-cutting
Application:
Security
System
|
|
|
|
|
|
| Flexible
& Rigid Flexible
PCB Series |
|
|
|
|
|
|
DSC01040
Specification:
Polyimide
(kapton),
1mil
to
2
mil,
10g
copper
Electrolytic
Plate
Nickel/Gold,
outline
by
punching
Application:
Cell
phone
|
|
|
|
|
|
|
|
DSC01036
Specification:
Polyimide
(kapton),
1mil
to
2
mil,
10g
copper
Immersion
Nickel/Gold
Application:
Printer
|
|
|
|
|
|
| Other
Special PCB Series |
|
|
|
|
|
|
DSC01035
Specification:
Aluminum
heat
sink
board,
1.6mm
S/S
HAL
finishing,
outline
by
punching
Application:
Computer
|
|
|
|
|
|
|
|
DSC01038
Specification:
Telfon
(PTFE)
material,
1.0mm
S/S
Entek
finishing,
outline
by
punching
Application:
High
Frequency
Products
|
|
|
|
|
|
|
|
|
DSC01033
Specification:
FR-4
(halogen
free)
material,
1.6mm
,
D/S
HAL
finishing,
outline
by
punching
Application:
Telecom
|
|
|
|
|
|
| Contract
Assembly/Manufacturing
Series |
|
|
|
|
|
|
DSC01032
Specification:
SMT
&
Through
holes
assembly
or
COB
assembly
In
circuit
Testing
or
functional
testing
Application:
Telecom
|
|
|
|
|
|
|
|
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|
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|
 |
|
| |
|
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