back
 
 
 
We make:
Single side up to 14 layers Rigid PCBs
Flash / Hard Gold Plating (120u”)
Lead Free Difference finishing / Hot Air Solder Leveling
Peelable Mask / Carbon Ink Printing
Immersion Tin / Gold (Flash/Thick) / Siliver
Selective Plating / Entek Coating
CNC V-Cut / Gold Finger Process
Blind/Buried Via Hole for M/L
RoHS or Hologen Free PCBs
Flexible or Flexible – Rigid single & multilayer PCBs
Aluminum Based Single & Double Side PCBs

Delivery Lead Time

 

 
(mass production)

Single Side PCBs – 1 week

Double Side PCBs – 10 days
4-6 layers PCBs – 14 days
8-10 layers PCBs – 21 days
12-14 layers PCBs – 30days
 
(Samples)

Normal

4 days for Single Side PCBs

6 days for Double Side PCBs
10 days for 4 layers PCBs
12 days for 6 layers PCBs
14 days for 8-10 layers PCBs
21 days for 12-14 layers PCBs

Quick turn

2-4 days for Single & Double Side PCBs
7 days for 4-6 layers PCBs
To be confirmed after checked your PCBs specification for 8-14 layers.


Single Side PCBs Series  

DSC01034
Specification:
FR-4 1.6mm, 1g copper, single side. Flash gold plating, LPISM, outline by punching

Application:
Keyboard

Other Material could be used: CEM-1, CEM-3, FR-1 & FR-2
 

Double Side PCBs Series  

DSC00266
Specification:
FR-4, 1.6mm , 1g copper, double side HAL with hard gold finger plating, LPISM outline by CNC Routing & gold finger chamfering

Application:
Add on card for computer

DSC00265
Specification:
FR-4, 1.6mm, 1g copper, double side Immersion gold plating, LPISM, outline by CNC Routing

Application:
Databank



Multilayers PCB Series (4-14 layers)  

DSC00267
Specification:
FR-4, 1.6mm , 20g copper, 4 layers Entete finishing, LPISM, outline by CNC Rounting & v-cutting

Application:
Telecom

DSC01037
Specification:
FR-4, 1.6mm , 10g copper, 8 layers Immersion tin, LPISM, outline by CNC Rounting & v-cutting

Application:
Security System



Flexible & Rigid Flexible PCB Series  

DSC01040
Specification:
Polyimide (kapton), 1mil to 2 mil, 10g copper Electrolytic Plate Nickel/Gold, outline by punching

Application:
Cell phone

DSC01036
Specification:
Polyimide (kapton), 1mil to 2 mil, 10g copper Immersion Nickel/Gold

Application:
Printer



Other Special PCB Series  

DSC01035
Specification:
Aluminum heat sink board, 1.6mm S/S HAL finishing, outline by punching

Application:
Computer

DSC01038
Specification:
Telfon (PTFE) material, 1.0mm S/S Entek finishing, outline by punching

Application:
High Frequency Products


DSC01033
Specification:
FR-4 (halogen free) material, 1.6mm , D/S HAL finishing, outline by punching

Application:
Telecom

 

Contract Assembly/Manufacturing Series  

DSC01032
Specification:
SMT & Through holes assembly or COB assembly In circuit Testing or functional testing

Application:
Telecom

 
 
 
Copyright All Rights Reserved.